Improving the fatigue life of a bare die flip chip by thinning

T. Alander, I. Suominen, P. Heino, E. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

4 Citations (Scopus)

Translated title of the contribution	Improving the fatigue life of a bare die flip chip by thinning
Original language	English
Pages (from-to)	s. 14
Journal	Soldering and Surface Mount Technology
Volume	15
Issue number	3
Publication status	Published - 2003
Publication type	A1 Journal article-refereed

Publication forum classification

@article{cd35770862fc413aa50b1e9d445be469,

title = "Improving the fatigue life of a bare die flip chip by thinning",

author = "T. Alander and I. Suominen and P. Heino and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2003",

language = "English",

volume = "15",

pages = "s. 14",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Group Publishing Ltd.",

number = "3",

}