Improving the fatigue life of a bare die flip chip by thinning

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4 Citations (Scopus)

Translated title of the contribution	Improving the fatigue life of a bare die flip chip by thinning
Original language	English
Pages (from-to)	s. 14
Journal	Soldering and Surface Mount Technology
Volume	15
Issue number	3
Publication status	Published - 2003
Publication type	A1 Journal article-refereed

Publication forum classification

@article{cd35770862fc413aa50b1e9d445be469,

title = "Improving the fatigue life of a bare die flip chip by thinning",

author = "T. Alander and I. Suominen and P. Heino and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2003",

language = "English",

volume = "15",

pages = "s. 14",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Publishing",

number = "3",

}