Influence of moisture on the reliability of no-flow underfilled flip chips

K. Kokko, E. Ristolainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Translated title of the contributionInfluence of moisture on the reliability of no-flow underfilled flip chips
    Original languageEnglish
    Title of host publication3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics 21-23 October 2003, Montreux, Switzerland
    Pages63-67
    Publication statusPublished - 2003
    Publication typeA4 Article in conference proceedings

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