Translated title of the contribution | Influence of moisture on the reliability of no-flow underfilled flip chips |
---|---|
Original language | English |
Title of host publication | 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics 21-23 October 2003, Montreux, Switzerland |
Pages | 63-67 |
Publication status | Published - 2003 |
Publication type | A4 Article in conference proceedings |
Publication forum classification
- No publication forum level