Inkjet-deposited interconnections for electronic packaging

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

43 Citations (Scopus)

Translated title of the contribution	Inkjet-deposited interconnections for electronic packaging
Original language	English
Title of host publication	NIP23. 23rd International Conference on Digital Printing Technologies, September 16-21, 2007, Anchorage, Alaska
Pages	813-817
Publication status	Published - 2007
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{1318e6632ec041948bc2b9f2e7f5e77c,

title = "Inkjet-deposited interconnections for electronic packaging",

author = "M. M{\"a}ntysalo and P. Mansikkam{\"a}ki",

note = "Contribution: organisation=ele,FACT1=1",

year = "2007",

language = "English",

pages = "813--817",

booktitle = "NIP23. 23rd International Conference on Digital Printing Technologies, September 16-21, 2007, Anchorage, Alaska",

}