Inkjet Filling of TSVs with Silver Nanoparticle Ink

Behnam Khorramdel; Matti Mäntysalo

doi:10.1109/ESTC.2014.6962741

Inkjet Filling of TSVs with Silver Nanoparticle Ink

Behnam Khorramdel, Matti Mäntysalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

15 Citations (Scopus)

15 Downloads (Pure)

Translated title of the contribution	Inkjet Filling of TSVs with Silver Nanoparticle Ink
Original language	English
Title of host publication	2014 Electronics System-Integration Technology Conference (ESTC), 16-18 September 2014, Helsinki, Finland
Publisher	IEEE
Pages	1-5
Number of pages	5
ISBN (Print)	978-1-4799-4026-4
DOIs	https://doi.org/10.1109/ESTC.2014.6962741
Publication status	Published - 2014
Publication type	A4 Article in conference proceedings
Event	Electronics System-Integration Technology Conference - Duration: 1 Jan 2014 → …

Conference

Conference	Electronics System-Integration Technology Conference
Period	1/01/14 → …

Publication forum classification

Publication forum level 1

Access to Document

10.1109/ESTC.2014.6962741

Khorramdel_Mantysalo_2014_Inkjet_filling_of_TSVs_with_silver_nanoparticle_ink-1
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Accepted author manuscript, 284 KBLicence: Unspecified

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Cite this

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title = "Inkjet Filling of TSVs with Silver Nanoparticle Ink",

author = "Behnam Khorramdel and Matti M{\"a}ntysalo",

note = "Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-11-10<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE; Electronics System-Integration Technology Conference ; Conference date: 01-01-2014",

year = "2014",

doi = "10.1109/ESTC.2014.6962741",

language = "English",

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TY - GEN

T1 - Inkjet Filling of TSVs with Silver Nanoparticle Ink

AU - Khorramdel, Behnam

AU - Mäntysalo, Matti

N1 - Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-11-10<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2014

Y1 - 2014

U2 - 10.1109/ESTC.2014.6962741

DO - 10.1109/ESTC.2014.6962741

M3 - Conference contribution

SN - 978-1-4799-4026-4

SP - 1

EP - 5

BT - 2014 Electronics System-Integration Technology Conference (ESTC), 16-18 September 2014, Helsinki, Finland

PB - IEEE

T2 - Electronics System-Integration Technology Conference

Y2 - 1 January 2014

ER -