Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Ayat Soltani; Tero Kumpulainen; Matti Mäntysalo

doi:10.1109/ECTC.2014.6897523

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Translated title of the contribution	Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer
Original language	English
Title of host publication	2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL
Publisher	IEEE
Pages	1685-1689
Number of pages	5
ISBN (Print)	978-1-4799-2407-3
DOIs	https://doi.org/10.1109/ECTC.2014.6897523
Publication status	Published - 2014
Publication type	A4 Article in conference proceedings
Event	Electronic Components and Technology Conference - Duration: 1 Jan 2014 → …

Conference

Conference	Electronic Components and Technology Conference
Period	1/01/14 → …

Publication forum classification

Publication forum level 1

Access to Document

10.1109/ECTC.2014.6897523

9 Citations
1 Article

Laser sintering of copper nanoparticles on top of silicon substrates
Soltani, A., Khorramdel, B., Mardoukhi, A. & Mäntysalo, M., 9 Dec 2015, In: Nanotechnology. 27, 3, 5 p., 035203.
Research output: Contribution to journal › Article › Scientific › peer-review

Open Access
File
36 Citations (Scopus)

172 Downloads (Pure)

Cite this

@inproceedings{2110969a16bc493c8b9cddd6390b5c78,

title = "Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer",

author = "Ayat Soltani and Tero Kumpulainen and Matti M{\"a}ntysalo",

note = "Contribution: organisation=elt,FACT1=0.9 Contribution: organisation=mei,FACT2=0.1 Portfolio EDEND: 2014-10-09 Publisher name: Institute of Electrical and Electronics Engineers IEEE; Electronic Components and Technology Conference ; Conference date: 01-01-2014",

year = "2014",

doi = "10.1109/ECTC.2014.6897523",

language = "English",

isbn = "978-1-4799-2407-3",

pages = "1685--1689",

booktitle = "2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL",

publisher = "IEEE",

address = "United States",

}

Soltani, A, Kumpulainen, T & Mäntysalo, M 2014, Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer. in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL. IEEE, pp. 1685-1689, Electronic Components and Technology Conference, 1/01/14. https://doi.org/10.1109/ECTC.2014.6897523

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer. / Soltani, Ayat; Kumpulainen, Tero ; Mäntysalo, Matti.
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL. IEEE, 2014. p. 1685-1689.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

AU - Soltani, Ayat

AU - Kumpulainen, Tero

AU - Mäntysalo, Matti

N1 - Contribution: organisation=elt,FACT1=0.9 Contribution: organisation=mei,FACT2=0.1 Portfolio EDEND: 2014-10-09 Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2014

Y1 - 2014

U2 - 10.1109/ECTC.2014.6897523

DO - 10.1109/ECTC.2014.6897523

M3 - Conference contribution

SN - 978-1-4799-2407-3

SP - 1685

EP - 1689

BT - 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL

PB - IEEE

T2 - Electronic Components and Technology Conference

Y2 - 1 January 2014

ER -

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Conference

Publication forum classification

Access to Document

Research output

Laser sintering of copper nanoparticles on top of silicon substrates

Cite this