Inkjet printing in manufacturing of stretchable interconnects

Toni Liimatta; Eerik Halonen; Hannu Sillanpää; Juha Niittynen; Matti Mäntysalo

doi:10.1109/ECTC.2014.6897281

Inkjet printing in manufacturing of stretchable interconnects

Toni Liimatta, Eerik Halonen, Hannu Sillanpää, Juha Niittynen, Matti Mäntysalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

26 Citations (Scopus)

Translated title of the contribution	Inkjet printing in manufacturing of stretchable interconnects
Original language	English
Title of host publication	2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL
Publisher	IEEE
Pages	151-156
Number of pages	6
ISBN (Print)	978-1-4799-2407-3
DOIs	https://doi.org/10.1109/ECTC.2014.6897281
Publication status	Published - 2014
Publication type	A4 Article in conference proceedings
Event	Electronic Components and Technology Conference - Duration: 1 Jan 2014 → …

Conference

Conference	Electronic Components and Technology Conference
Period	1/01/14 → …

Publication forum classification

Publication forum level 1

Access to Document

10.1109/ECTC.2014.6897281

Cite this

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title = "Inkjet printing in manufacturing of stretchable interconnects",

author = "Toni Liimatta and Eerik Halonen and Hannu Sillanp{\"a}{\"a} and Juha Niittynen and Matti M{\"a}ntysalo",

note = "Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-09-30<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE; Electronic Components and Technology Conference ; Conference date: 01-01-2014",

year = "2014",

doi = "10.1109/ECTC.2014.6897281",

language = "English",

isbn = "978-1-4799-2407-3",

pages = "151--156",

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publisher = "IEEE",

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}

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T1 - Inkjet printing in manufacturing of stretchable interconnects

AU - Liimatta, Toni

AU - Halonen, Eerik

AU - Sillanpää, Hannu

AU - Niittynen, Juha

AU - Mäntysalo, Matti

N1 - Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-09-30<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2014

Y1 - 2014

U2 - 10.1109/ECTC.2014.6897281

DO - 10.1109/ECTC.2014.6897281

M3 - Conference contribution

SN - 978-1-4799-2407-3

SP - 151

EP - 156

BT - 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL

PB - IEEE

T2 - Electronic Components and Technology Conference

Y2 - 1 January 2014

ER -