Translated title of the contribution | Integrating passive components with thin-film deposition |
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Original language | English |
Pages (from-to) | 38-48 |
Journal | HDI, The Magazine of High-Density Interconnect |
Volume | 3 |
Issue number | 7 |
Publication status | Published - 2000 |
Publication type | D1 Article in a trade journal |
Publication forum classification
- No publication forum level