Abstract
The trend for thinner devices is a key driver to remove all extra space inside an electronic device. This paper discusses elimination of the multilayer printed wiring board (PWB) as a separate component by using it as an injection mould insert. Two different multilayer PWBs base materials were selected: a polyolefin-based thermoplastic and a traditional thermosetting polymer, and two different tests were carried out. Process tests were performed to find out if the electronic components could survive the injection moulding process. Temperature cycling tests were conducted to verify the adhesion of the inserts. Both populated and unpopulated PWB inserts were included in the process study.
| Original language | English |
|---|---|
| Title of host publication | ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings |
| Publisher | IEEE |
| Pages | 1342-1346 |
| Number of pages | 5 |
| ISBN (Print) | 1-4244-0552-1 |
| Publication status | Published - 2006 |
| Publication type | A4 Article in conference proceedings |
| Event | Electronics System-Integration Technology Conference - Duration: 1 Jan 2014 → … |
Conference
| Conference | Electronics System-Integration Technology Conference |
|---|---|
| Period | 1/01/14 → … |
Publication forum classification
- Publication forum level 1