Integration of multilayer PWB into plastic covers by injection moulding

Tero Peltola

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    8 Citations (Scopus)


    The trend for thinner devices is a key driver to remove all extra space inside an electronic device. This paper discusses elimination of the multilayer printed wiring board (PWB) as a separate component by using it as an injection mould insert. Two different multilayer PWBs base materials were selected: a polyolefin-based thermoplastic and a traditional thermosetting polymer, and two different tests were carried out. Process tests were performed to find out if the electronic components could survive the injection moulding process. Temperature cycling tests were conducted to verify the adhesion of the inserts. Both populated and unpopulated PWB inserts were included in the process study.

    Original languageEnglish
    Title of host publicationESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings
    Number of pages5
    ISBN (Print)1-4244-0552-1
    Publication statusPublished - 2006
    Publication typeA4 Article in conference proceedings
    EventElectronics System-Integration Technology Conference -
    Duration: 1 Jan 2014 → …


    ConferenceElectronics System-Integration Technology Conference
    Period1/01/14 → …

    Publication forum classification

    • Publication forum level 1


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