| Translated title of the contribution | Intermetallic compounas in soft soldering |
|---|---|
| Original language | English |
| Place of Publication | Tampere |
| Publisher | TTKK |
| Number of pages | 41 |
| Publication status | Published - 1999 |
| Publication type | D4 Published development or research report or study |
Publication series
| Name | Tampereen Teknillinen Korkeakoulu, Materiaaliopin laitos, Raportti |
|---|---|
| Publisher | TTKK |
| No. | 10/1999 |
Publication forum classification
- No publication forum level
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