Laser-Assisted Bonding Approach for Photonic Integration Processes

Aleksandr A. Vlasov; Topi Uusitalo; Evgenii Lepukhov; Heikki Virtanen; Samu-Pekka Ojanen; Jukka Viheriälä; Mircea Guina

doi:10.23919/EMPC55870.2023.10418296

Laser-Assisted Bonding Approach for Photonic Integration Processes

Aleksandr A. Vlasov, Topi Uusitalo, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina

Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

5 Citations (Scopus)

46 Downloads (Pure)

Abstract

Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using silicon-photonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermal-induced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.

Original language	English
Title of host publication	24th European Microelectronics and Packaging Conference, EMPC 2023
Publisher	IEEE
ISBN (Print)	978-1-6654-8736-8
DOIs	https://doi.org/10.23919/EMPC55870.2023.10418296
Publication status	Published - 2023
Publication type	A4 Article in conference proceedings
Event	European Microelectronics and Packaging Conference - Cambridge, United Kingdom Duration: 11 Sept 2023 → 14 Sept 2023 Conference number: 24

Conference

Conference	European Microelectronics and Packaging Conference
Abbreviated title	EMPC
Country/Territory	United Kingdom
City	Cambridge
Period	11/09/23 → 14/09/23

Keywords

assembly processes
infrared imaging
infrared microscopy
laser-assisted bonding
photonic integration
silicon devices
silicon photonics
through-silicon vision

Publication forum classification

Publication forum level 1

ASJC Scopus subject areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials
Polymers and Plastics
Instrumentation

Access to Document

10.23919/EMPC55870.2023.10418296

Laser-Assisted Bonding
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Accepted author manuscript, 806 KBLicence: Unspecified

https://urn.fi/URN:NBN:fi:tuni-202408238264Licence: Unspecified

Cite this

@inproceedings{21bae241a1a54d2eaaf6c70eeee8c549,

title = "Laser-Assisted Bonding Approach for Photonic Integration Processes",

abstract = "Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using silicon-photonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermal-induced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.",

keywords = "assembly processes, infrared imaging, infrared microscopy, laser-assisted bonding, photonic integration, silicon devices, silicon photonics, through-silicon vision",

author = "Vlasov, {Aleksandr A.} and Topi Uusitalo and Evgenii Lepukhov and Heikki Virtanen and Samu-Pekka Ojanen and Jukka Viheri{\"a}l{\"a} and Mircea Guina",

note = "Publisher Copyright: {\textcopyright} 2023 IMAPS-Europe.; European Microelectronics and Packaging Conference, EMPC ; Conference date: 11-09-2023 Through 14-09-2023",

year = "2023",

doi = "10.23919/EMPC55870.2023.10418296",

language = "English",

isbn = "978-1-6654-8736-8",

booktitle = "24th European Microelectronics and Packaging Conference, EMPC 2023",

publisher = "IEEE",

address = "United States",

}

Vlasov, AA, Uusitalo, T, Lepukhov, E, Virtanen, H, Ojanen, S-P , Viheriälä, J & Guina, M 2023, Laser-Assisted Bonding Approach for Photonic Integration Processes. in 24th European Microelectronics and Packaging Conference, EMPC 2023. IEEE, European Microelectronics and Packaging Conference, Cambridge, United Kingdom, 11/09/23. https://doi.org/10.23919/EMPC55870.2023.10418296

TY - GEN

T1 - Laser-Assisted Bonding Approach for Photonic Integration Processes

AU - Vlasov, Aleksandr A.

AU - Uusitalo, Topi

AU - Lepukhov, Evgenii

AU - Virtanen, Heikki

AU - Ojanen, Samu-Pekka

AU - Viheriälä, Jukka

AU - Guina, Mircea

N1 - Conference code: 24

PY - 2023

Y1 - 2023

N2 - Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using silicon-photonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermal-induced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.

AB - Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using silicon-photonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermal-induced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.

KW - assembly processes

KW - infrared imaging

KW - infrared microscopy

KW - laser-assisted bonding

KW - photonic integration

KW - silicon devices

KW - silicon photonics

KW - through-silicon vision

U2 - 10.23919/EMPC55870.2023.10418296

DO - 10.23919/EMPC55870.2023.10418296

M3 - Conference contribution

AN - SCOPUS:85169421619

SN - 978-1-6654-8736-8

BT - 24th European Microelectronics and Packaging Conference, EMPC 2023

PB - IEEE

T2 - European Microelectronics and Packaging Conference

Y2 - 11 September 2023 through 14 September 2023

ER -

Laser-Assisted Bonding Approach for Photonic Integration Processes

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Keywords

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