Laser sintering of copper nanoparticles on top of silicon substrates

A. Soltani; B. Khorramdel; A. Mardoukhi; M. Mäntysalo

doi:10.1088/0957-4484/27/3/035203

Laser sintering of copper nanoparticles on top of silicon substrates

A. Soltani, B. Khorramdel, A. Mardoukhi, M. Mäntysalo

Research output: Contribution to journal › Article › Scientific › peer-review

34 Citations (Scopus)

148 Downloads (Pure)

Abstract

This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

Original language	English
Article number	035203
Number of pages	5
Journal	Nanotechnology
Volume	27
Issue number	3
DOIs	https://doi.org/10.1088/0957-4484/27/3/035203
Publication status	Published - 9 Dec 2015
Publication type	A1 Journal article-refereed

Keywords

inkjet
sintering
Resistance
Nanoparticles

Publication forum classification

Publication forum level 2

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1088/0957-4484/27/3/035203Licence: CC BY

Laser sintering of copper nanoparticles on top of silicon substrates
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence (http://creativecommons.org/licenses/by/3.0/). Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
Final published version, 1.1 MBLicence: CC BY

http://urn.fi/URN:NBN:fi:tty-201604183808Licence: CC BY

1 Regular membership of a society or network

IEC, TC 119/WG 4 Printability (External organisation)
Mäntysalo, M. (Position of trust)
2014 → 2016
Activity: Membership › Regular membership of a society or network

34 Citations
2 Conference contribution

Inkjet printed single layer high-density circuitry for a MEMS device
Laurila, M.-M., Soltani, A. & Mäntysalo, M., 15 Jul 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE, p. 968-972 5 p.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Open Access
File
8 Citations (Scopus)

23 Downloads (Pure)
Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer
Soltani, A., Kumpulainen, T. & Mäntysalo, M., 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL. IEEE, p. 1685-1689 5 p.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

8 Citations (Scopus)

Cite this

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title = "Laser sintering of copper nanoparticles on top of silicon substrates",

abstract = "This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.",

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AU - Mardoukhi, A.

AU - Mäntysalo, M.

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N2 - This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

AB - This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

KW - inkjet

KW - sintering

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Laser sintering of copper nanoparticles on top of silicon substrates

Abstract

Keywords

Publication forum classification

ASJC Scopus subject areas

Access to Document

Fingerprint

Activities

IEC, TC 119/WG 4 Printability (External organisation)

Research output

Inkjet printed single layer high-density circuitry for a MEMS device

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Cite this