Layer-to-Layer Thermal History Prediction for Thin Walls in Metal Additive Manufacturing

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publication43rd Computers and Information in Engineering Conference (CIE)
PublisherAmerican Society of Mechanical Engineers
Number of pages10
Volume2
ISBN (Electronic)978-0-7918-8729-5
DOIs
Publication statusPublished - 21 Nov 2023
Publication typeA4 Article in conference proceedings
EventASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference - Boston, United States
Duration: 20 Aug 202323 Aug 2023

Conference

ConferenceASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference
Country/TerritoryUnited States
CityBoston
Period20/08/2323/08/23

Keywords

  • Layer-to-layer thermal history prediction
  • Online prediction
  • Thermal history modeling

Publication forum classification

  • Publication forum level 1

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