Materials for electronics by thermal spraying

Helena Ronkainen, Ulla Kanerva, Tommi Varis, Kimmo Ruusuvuori, Erja Turunen, Jani Peräntie, Jussi Putaala, Jari Juuti, Heli Jantunen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    2 Citations (Scopus)


    In this paper, dielectric and conductive properties of thermally sprayed Al2O3- and Cubased coatings on steel and alumina substrates were studied. Alumina powders with nano- and micro-sized additions of Ni, NiO, TiO2, silica, and commercial glass were used in High Velocity Oxygen Fuel (HVOF) deposition. The conventional commercial copper powder and three Ag, WC and H2 -modified powders were used in Direct Write Thermal Spray (DWTS) deposition. Mixed phases of α-Al2O3 and γ-Al2O3 were found to be present in the as-deposited coatings. Sprayed alumina-based composites exhibited dielectric permittivity of 5.3-13.9 and losses of 0.002-0.178 at 1 MHz and 1 GHz while the additions tend to increase the values. Sprayed compositions with glasstype additions were found to retain α-Al2O3 crystalline phase after the deposition. Cu depositions, especially modified ones, realised by Direct Write Thermal Spray (DWTS) showed conductivity values as high as 42-56% of IACS values. The results demonstrate that ceramic and conductive coatings fabricated by thermal spray techniques show feasible properties for electrical applications, such as low-frequency components and insulation layers to be utilised in embedded 3D circuitry, in a way that is not possible through traditional manufacturing methods.

    Original languageEnglish
    Title of host publicationPhysical and Numerical Simulation of Materials Processing VII
    Number of pages6
    Publication statusPublished - 2013
    Publication typeA4 Article in conference proceedings
    Event7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013 - Oulu, Finland
    Duration: 16 Jun 201319 Jun 2013

    Publication series

    NameMaterials Science Forum
    ISSN (Print)02555476


    Conference7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013


    • Conductivity
    • Dielectric properties
    • Direct write thermal spray
    • HVOF
    • Thermal spraying

    ASJC Scopus subject areas

    • General Materials Science
    • Condensed Matter Physics
    • Mechanical Engineering
    • Mechanics of Materials


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