Translated title of the contribution | Mechanical properties of nanoscale copper under shear |
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Original language | English |
Pages (from-to) | 435-441 |
Journal | Microelectronics Reliability |
Volume | 40 |
Issue number | 3 |
Publication status | Published - 2000 |
Publication type | A1 Journal article-refereed |
Publication forum classification
- Publication forum level 1