| Translated title of the contribution | Mechanical properties of nanoscale copper under shear |
|---|---|
| Original language | English |
| Pages (from-to) | 435-441 |
| Journal | Microelectronics Reliability |
| Volume | 40 |
| Issue number | 3 |
| Publication status | Published - 2000 |
| Publication type | A1 Journal article-refereed |
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