Metallization of high density TSVs using super inkjet technology

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    11 Citations (Scopus)

    Abstract

    Filling or metallization of the through silicon vias (TSVs) with the conductive materials to act as vertical electrical interconnections through the wafers, is one of the key steps in the microelectromechanical systems (MEMS) wafer level packaging. Previously, metallization of the vias with inkjet printing technology is demonstrated. However, little attention has been paid to the possibility of metallization of high density TSVs; because drop diameters of conventional inkjet printers are larger than the top diameter of thin vias. Therefore, in this work we investigate the potential of super inkjet (SIJ) technology with 0.1 femtoliter droplets to metallize the vias with top diameter of 23 µm using three different silver nanoparticle inks. The filling processes are monitored by the observation camera and after the sintering, cross-sections of the vias are studied by the optical and scanning electron microscope (SEM).
    Original languageEnglish
    Title of host publication2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
    PublisherIEEE
    Pages41-45
    Number of pages5
    ISBN (Print)9781479986095
    DOIs
    Publication statusPublished - 1 May 2015
    Publication typeA4 Article in a conference publication
    EventIEEE Electronic Components and Technology Conference - , United States
    Duration: 1 Jan 2000 → …

    Conference

    ConferenceIEEE Electronic Components and Technology Conference
    Country/TerritoryUnited States
    Period1/01/00 → …

    Keywords

    • Filling,Ink,Nanoparticles,Printing,Silver,Solvents,Through-silicon vias

    Publication forum classification

    • Publication forum level 1

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