Metallization of high density TSVs using super inkjet technology

Behnam Khorramdel; Mika Matti Laurila; Matti Mäntysalo

doi:10.1109/ECTC.2015.7159569

Metallization of high density TSVs using super inkjet technology

Behnam Khorramdel
, Mika Matti Laurila
, Matti Mäntysalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

17 Citations (Scopus)

28 Downloads (Pure)

Abstract

Filling or metallization of the through silicon vias (TSVs) with the conductive materials to act as vertical electrical interconnections through the wafers, is one of the key steps in the microelectromechanical systems (MEMS) wafer level packaging. Previously, metallization of the vias with inkjet printing technology is demonstrated. However, little attention has been paid to the possibility of metallization of high density TSVs; because drop diameters of conventional inkjet printers are larger than the top diameter of thin vias. Therefore, in this work we investigate the potential of super inkjet (SIJ) technology with 0.1 femtoliter droplets to metallize the vias with top diameter of 23 µm using three different silver nanoparticle inks. The filling processes are monitored by the observation camera and after the sintering, cross-sections of the vias are studied by the optical and scanning electron microscope (SEM).

Original language	English
Title of host publication	2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Publisher	IEEE
Pages	41-45
Number of pages	5
ISBN (Print)	9781479986095
DOIs	https://doi.org/10.1109/ECTC.2015.7159569
Publication status	Published - 1 May 2015
Publication type	A4 Article in conference proceedings
Event	IEEE Electronic Components and Technology Conference - , United States Duration: 1 Jan 2000 → …

Conference

Conference	IEEE Electronic Components and Technology Conference
Country/Territory	United States
Period	1/01/00 → …

Keywords

Filling,Ink,Nanoparticles,Printing,Silver,Solvents,Through-silicon vias

Publication forum classification

Publication forum level 1

Access to Document

10.1109/ECTC.2015.7159569

Khorramdel_Laurila_Mantysalo_2015_Metallization_of_high_density_TSVs_using_super_inkjet_technology
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Accepted author manuscript, 722 KBLicence: Unspecified

https://urn.fi/URN:NBN:fi:tuni-202310198934Licence: Unspecified

High-resolution E-jet Enhanced MEMS Packaging
Laurila, M.-M., Khorramdel Vahed, B. & Mäntysalo, M., 27 Aug 2018, p. NA. 1 p.
Research output: Other conference contribution › Abstract › Scientific

Open Access

Cite this

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title = "Metallization of high density TSVs using super inkjet technology",

abstract = "Filling or metallization of the through silicon vias (TSVs) with the conductive materials to act as vertical electrical interconnections through the wafers, is one of the key steps in the microelectromechanical systems (MEMS) wafer level packaging. Previously, metallization of the vias with inkjet printing technology is demonstrated. However, little attention has been paid to the possibility of metallization of high density TSVs; because drop diameters of conventional inkjet printers are larger than the top diameter of thin vias. Therefore, in this work we investigate the potential of super inkjet (SIJ) technology with 0.1 femtoliter droplets to metallize the vias with top diameter of 23 µm using three different silver nanoparticle inks. The filling processes are monitored by the observation camera and after the sintering, cross-sections of the vias are studied by the optical and scanning electron microscope (SEM).",

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author = "Behnam Khorramdel and Laurila, \{Mika Matti\} and Matti M{\"a}ntysalo",

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pages = "41--45",

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publisher = "IEEE",

address = "United States",

note = "IEEE Electronic Components and Technology Conference ; Conference date: 01-01-2000",

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TY - GEN

T1 - Metallization of high density TSVs using super inkjet technology

AU - Khorramdel, Behnam

AU - Laurila, Mika Matti

AU - Mäntysalo, Matti

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N2 - Filling or metallization of the through silicon vias (TSVs) with the conductive materials to act as vertical electrical interconnections through the wafers, is one of the key steps in the microelectromechanical systems (MEMS) wafer level packaging. Previously, metallization of the vias with inkjet printing technology is demonstrated. However, little attention has been paid to the possibility of metallization of high density TSVs; because drop diameters of conventional inkjet printers are larger than the top diameter of thin vias. Therefore, in this work we investigate the potential of super inkjet (SIJ) technology with 0.1 femtoliter droplets to metallize the vias with top diameter of 23 µm using three different silver nanoparticle inks. The filling processes are monitored by the observation camera and after the sintering, cross-sections of the vias are studied by the optical and scanning electron microscope (SEM).

AB - Filling or metallization of the through silicon vias (TSVs) with the conductive materials to act as vertical electrical interconnections through the wafers, is one of the key steps in the microelectromechanical systems (MEMS) wafer level packaging. Previously, metallization of the vias with inkjet printing technology is demonstrated. However, little attention has been paid to the possibility of metallization of high density TSVs; because drop diameters of conventional inkjet printers are larger than the top diameter of thin vias. Therefore, in this work we investigate the potential of super inkjet (SIJ) technology with 0.1 femtoliter droplets to metallize the vias with top diameter of 23 µm using three different silver nanoparticle inks. The filling processes are monitored by the observation camera and after the sintering, cross-sections of the vias are studied by the optical and scanning electron microscope (SEM).

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SN - 9781479986095

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BT - 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

PB - IEEE

T2 - IEEE Electronic Components and Technology Conference

Y2 - 1 January 2000

ER -

Metallization of high density TSVs using super inkjet technology

Abstract

Conference

Keywords

Publication forum classification

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Research output

High-resolution E-jet Enhanced MEMS Packaging

Cite this