Metallization of microvias by sputter-deposition

Translated title of the contribution: Metallization of microvias by sputter-deposition

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3 Citations (Scopus)

Translated title of the contribution	Metallization of microvias by sputter-deposition
Original language	Finnish
Pages (from-to)	587-593
Journal	Microelectronics Reliability
Volume	44
Issue number	4
Publication status	Published - 2004
Publication type	A1 Journal article-refereed

Publication forum classification

@article{f48fd0dac0784327a8bb031b07302205,

title = "Metallization of microvias by sputter-deposition",

author = "T. Uusluoto and P. Jalonen and H. Laaksonen and A. Tuominen",

note = "ISSN: 0026-2714<br/>Contribution: organisation=pori etp,FACT1=1",

year = "2004",

language = "Suomi",

volume = "44",

pages = "587--593",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

number = "4",

}