Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

Research output: Contribution to journal › Article › Scientific › peer-review

12 Citations (Scopus)

Translated title of the contribution	Microstructure, creep properties, and failure mechanism of SnAgCu solder joints
Original language	English
Pages (from-to)	1600-1606
Journal	Journal of Electronic Materials
Volume	35
Issue number	7
Publication status	Published - 2006
Publication type	A1 Journal article-refereed

Publication forum classification

@article{a9bf7aa082c74f06ba14562ca8a589a9,

title = "Microstructure, creep properties, and failure mechanism of SnAgCu solder joints",

author = "J.J. Sundelin and S.T. Nurmi and T.K. Lepist{\"o} and E.O. Ristolainen",

note = "Contribution: organisation=mol,FACT1=1",

year = "2006",

language = "English",

volume = "35",

pages = "1600--1606",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "7",

}

TY - JOUR

T1 - Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

AU - Sundelin, J.J.

AU - Nurmi, S.T.

AU - Lepistö, T.K.

AU - Ristolainen, E.O.

N1 - Contribution: organisation=mol,FACT1=1

PY - 2006

Y1 - 2006

M3 - Article

SN - 0361-5235

VL - 35

SP - 1600

EP - 1606

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 7

ER -