Modeling the effect of assembly parameters on warpage and stresses of molded package for inkjet printing

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

5 Citations (Scopus)

Translated title of the contribution	Modeling the effect of assembly parameters on warpage and stresses of molded package for inkjet printing
Original language	English
Title of host publication	EMPC 2007. The 16th European Microelectronics and Packaging Conference & Exhibition, June 17-20, 2007, Oulu, Finland
Pages	5 p
Publication status	Published - 2007
Publication type	B3 Article in conference proceedings

Publication forum classification

@inproceedings{a2ca2102b26244cfa02b24ed2ad504c6,

title = "Modeling the effect of assembly parameters on warpage and stresses of molded package for inkjet printing",

author = "K. Kaija and J. Miettinen and M. M{\"a}ntysalo and P. Mansikkam{\"a}ki and M. Kuchiki and M. Tsubouchi and R. R{\"o}nkk{\"a}",

note = "Contribution: organisation=ele,FACT1=1",

year = "2007",

language = "English",

pages = "5 p",

booktitle = "EMPC 2007. The 16th European Microelectronics and Packaging Conference \& Exhibition, June 17-20, 2007, Oulu, Finland",

}

Modeling the effect of assembly parameters on warpage and stresses of molded package for inkjet printing. / Kaija, K.; Miettinen, J.; Mäntysalo, M. et al.
EMPC 2007. The 16th European Microelectronics and Packaging Conference & Exhibition, June 17-20, 2007, Oulu, Finland. 2007. p. 5 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

TY - GEN

T1 - Modeling the effect of assembly parameters on warpage and stresses of molded package for inkjet printing

AU - Kaija, K.

AU - Miettinen, J.

AU - Mäntysalo, M.

AU - Mansikkamäki, P.

AU - Kuchiki, M.

AU - Tsubouchi, M.

AU - Rönkkä, R.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2007

Y1 - 2007

M3 - Conference contribution

SP - 5 p

BT - EMPC 2007. The 16th European Microelectronics and Packaging Conference & Exhibition, June 17-20, 2007, Oulu, Finland

ER -