Modeling thermal behavior of system-in-package with dynamic compact model

K. Kaija, P. Heino, E. Ristolainen

    Research output: Contribution to journalArticleScientificpeer-review

    Translated title of the contributionModeling thermal behavior of system-in-package with dynamic compact model
    Original languageEnglish
    Pages (from-to)64-71
    JournalJournal of Microelectronics and Electronic Packaging
    Volume2
    Issue number1
    Publication statusPublished - 2005
    Publication typeA1 Journal article-refereed

    Publication forum classification

    • No publication forum level

    Cite this