| Translated title of the contribution | Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper |
|---|---|
| Original language | English |
| Title of host publication | 1999 International Conference on Modeling and Simulation of Microsystems MSM99, April 19-21, 1999, San Juan Marriot, San Juan, Puerto Rico, USA |
| Place of Publication | San Juan, USA |
| Pages | 475-478 |
| Publication status | Published - 1999 |
| Publication type | B3 Article in conference proceedings |
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