Novel bumpless flip chip bonding

R. Lahtinen, M. Lyyra, J.P. Rautiainen, T. Uusluoto, A. Tuominen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Translated title of the contributionNovel bumpless flip chip bonding
    Original languageEnglish
    Title of host publicationSikula, J. (ed.). Proceedings of the 3rd European microelectronics and packaging symposium with table top exhibition, Drive the Future, Prague, Czech Republic, June 16-18, 2004
    Pages391-396
    Publication statusPublished - 2004
    Publication typeA4 Article in conference proceedings

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