Novel bumpless flip chip bonding

R. Lahtinen; M. Lyyra; J.P. Rautiainen; T. Uusluoto; A. Tuominen

Novel bumpless flip chip bonding

R. Lahtinen
, M. Lyyra
, J.P. Rautiainen
, T. Uusluoto
, A. Tuominen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Novel bumpless flip chip bonding
Original language	English
Title of host publication	Sikula, J. (ed.). Proceedings of the 3rd European microelectronics and packaging symposium with table top exhibition, Drive the Future, Prague, Czech Republic, June 16-18, 2004
Pages	391-396
Publication status	Published - 2004
Publication type	A4 Article in conference proceedings

Publication forum classification

No publication forum level

Cite this

@inproceedings{7df1a8167c3945e69405587c8a5217e2,

title = "Novel bumpless flip chip bonding",

author = "R. Lahtinen and M. Lyyra and J.P. Rautiainen and T. Uusluoto and A. Tuominen",

note = "ISBN 80-239-2835-X<br/>Contribution: organisation=pori etp,FACT1=1",

year = "2004",

language = "English",

pages = "391--396",

booktitle = "Sikula, J. (ed.). Proceedings of the 3rd European microelectronics and packaging symposium with table top exhibition, Drive the Future, Prague, Czech Republic, June 16-18, 2004",

}

Novel bumpless flip chip bonding. / Lahtinen, R.; Lyyra, M.; Rautiainen, J.P. et al.
Sikula, J. (ed.). Proceedings of the 3rd European microelectronics and packaging symposium with table top exhibition, Drive the Future, Prague, Czech Republic, June 16-18, 2004. 2004. p. 391-396.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Novel bumpless flip chip bonding

AU - Lahtinen, R.

AU - Lyyra, M.

AU - Rautiainen, J.P.

AU - Uusluoto, T.

AU - Tuominen, A.

N1 - ISBN 80-239-2835-X<br/>Contribution: organisation=pori etp,FACT1=1

PY - 2004

Y1 - 2004

M3 - Conference contribution

SP - 391

EP - 396

BT - Sikula, J. (ed.). Proceedings of the 3rd European microelectronics and packaging symposium with table top exhibition, Drive the Future, Prague, Czech Republic, June 16-18, 2004

ER -