Optical Setup for Laser-Assisted Bonding with Through-Silicon Microscopy Capabilities

Aleksandr Vlasov; Topi Uusitalo; Evgenii Lepukhov; Jukka Viheriälä; Mircea Guina

doi:10.1109/TCPMT.2025.3557118

Optical Setup for Laser-Assisted Bonding with Through-Silicon Microscopy Capabilities

Research output: Contribution to journal › Article › Scientific › peer-review

5 Citations (Scopus)

60 Downloads (Pure)

Original language	English
Pages (from-to)	885-893
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	15
Issue number	5
Early online date	2 Apr 2025
DOIs	https://doi.org/10.1109/TCPMT.2025.3557118
Publication status	Published - 2025
Publication type	A1 Journal article-refereed

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Publication forum level 1

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10.1109/TCPMT.2025.3557118Licence: CC BY

Optical_Setup_for_Laser-Assisted_Bonding_with_Through-Silicon_Microscopy_Capabilities-2Final published version, 1.71 MBLicence: CC BY

https://urn.fi/URN:NBN:fi:tuni-202504113615Licence: CC BY

Tampere Microscopy Center
Vippola, M. (Manager), Honkanen, M. (Operator) & Salminen, T. (Operator)
Faculty of Engineering and Natural Sciences
Facility/equipment: Research infrastructure

Cite this

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title = "Optical Setup for Laser-Assisted Bonding with Through-Silicon Microscopy Capabilities",

author = "Aleksandr Vlasov and Topi Uusitalo and Evgenii Lepukhov and Jukka Viheri{\"a}l{\"a} and Mircea Guina",

year = "2025",

doi = "10.1109/TCPMT.2025.3557118",

language = "English",

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pages = "885--893",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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TY - JOUR

T1 - Optical Setup for Laser-Assisted Bonding with Through-Silicon Microscopy Capabilities

AU - Vlasov, Aleksandr

AU - Uusitalo, Topi

AU - Lepukhov, Evgenii

AU - Viheriälä, Jukka

AU - Guina, Mircea

PY - 2025

Y1 - 2025

U2 - 10.1109/TCPMT.2025.3557118

DO - 10.1109/TCPMT.2025.3557118

M3 - Article

SN - 2156-3950

VL - 15

SP - 885

EP - 893

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 5

ER -

Optical Setup for Laser-Assisted Bonding with Through-Silicon Microscopy Capabilities

Publication forum classification

Access to Document

Equipment

Tampere Microscopy Center

Cite this