Translated title of the contribution | Optimization of Cooling Fins in Electronic Packages |
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Original language | English |
Title of host publication | 2nd Baltic Heat Transfer Conference, Riika, Latvia, 21-23 elokuuta 1995 |
Pages | 171-180 |
Publication status | Published - 1995 |
Publication type | B3 Article in conference proceedings |
Publication forum classification
- No publication forum level