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Optimization of Cooling Fins in Electronic Packages

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

    Translated title of the contributionOptimization of Cooling Fins in Electronic Packages
    Original languageEnglish
    Title of host publication2nd Baltic Heat Transfer Conference, Riika, Latvia, 21-23 elokuuta 1995
    Pages171-180
    Publication statusPublished - 1995
    Publication typeB3 Article in conference proceedings

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