Patenting for packaging and interconnections in microelectronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Patenting for packaging and interconnections in microelectronics
Original language	English
Title of host publication	2000 IEMT/IMC Symposium, April 19-21, 2000, Tokyo, Japan
Pages	233-238
Publication status	Published - 2000
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{3b2cf040cddc43caad340f8059f98f1f,

title = "Patenting for packaging and interconnections in microelectronics",

author = "J. Happonen and K. M{\"a}{\"a}tt{\"a}nen and A. Tuominen",

note = "Contribution: organisation=pori etp,FACT1=1",

year = "2000",

language = "English",

pages = "233--238",

booktitle = "2000 IEMT/IMC Symposium, April 19-21, 2000, Tokyo, Japan",

}