Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing

Bijan K. Tehrani; Benjamin S. Cook; Manos M. Tentzeris

doi:10.1109/APS.2015.7304690

Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing

Bijan K. Tehrani, Benjamin S. Cook, Manos M. Tentzeris

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

13 Citations (Scopus)

Abstract

This work outlines and demonstrates for the first time the utilization of inkjet printing processes for the fabrication of on-package mm-wave antenna structures. A multilayer, fully printed 30 GHz square patch antenna with a 120 μm thick dielectric substrate is fabricated directly onto an IC chip package through the use of metallic and dielectric inks. A probe station is used to measure the return loss of the fabricated on-package antenna, showing excellent agreement with simulations. This well defined process of fully additive antenna fabrication demonstrates the integrity of the inkjet printing process for on-package and on-chip antenna fabrication up to mm-wave frequency ranges.

Original language	English
Title of host publication	2015 IEEE Antennas and Propagation Society International Symposium, APS 2015 - Proceedings
Publisher	IEEE
Pages	607-608
Number of pages	2
Volume	2015-October
ISBN (Electronic)	9781479978151
DOIs	https://doi.org/10.1109/APS.2015.7304690
Publication status	Published - 22 Oct 2015
Publication type	A4 Article in conference proceedings
Event	IEEE Antennas and Propagation Society International Symposium, APS 2015 - Vancouver, Canada Duration: 19 Jul 2015 → 24 Jul 2015

Conference

Conference	IEEE Antennas and Propagation Society International Symposium, APS 2015
Country/Territory	Canada
City	Vancouver
Period	19/07/15 → 24/07/15

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.1109/APS.2015.7304690

Cite this

@inproceedings{729d5354d600471db77ae8aee2e0cd05,

title = "Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing",

abstract = "This work outlines and demonstrates for the first time the utilization of inkjet printing processes for the fabrication of on-package mm-wave antenna structures. A multilayer, fully printed 30 GHz square patch antenna with a 120 μm thick dielectric substrate is fabricated directly onto an IC chip package through the use of metallic and dielectric inks. A probe station is used to measure the return loss of the fabricated on-package antenna, showing excellent agreement with simulations. This well defined process of fully additive antenna fabrication demonstrates the integrity of the inkjet printing process for on-package and on-chip antenna fabrication up to mm-wave frequency ranges.",

author = "Tehrani, {Bijan K.} and Cook, {Benjamin S.} and Tentzeris, {Manos M.}",

year = "2015",

month = oct,

day = "22",

doi = "10.1109/APS.2015.7304690",

language = "English",

volume = "2015-October",

pages = "607--608",

booktitle = "2015 IEEE Antennas and Propagation Society International Symposium, APS 2015 - Proceedings",

publisher = "IEEE",

address = "United States",

note = "IEEE Antennas and Propagation Society International Symposium, APS 2015 ; Conference date: 19-07-2015 Through 24-07-2015",

}

Tehrani, BK, Cook, BS & Tentzeris, MM 2015, Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing. in 2015 IEEE Antennas and Propagation Society International Symposium, APS 2015 - Proceedings. vol. 2015-October, 7304690, IEEE, pp. 607-608, IEEE Antennas and Propagation Society International Symposium, APS 2015, Vancouver, Canada, 19/07/15. https://doi.org/10.1109/APS.2015.7304690

Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing. / Tehrani, Bijan K.; Cook, Benjamin S.; Tentzeris, Manos M.
2015 IEEE Antennas and Propagation Society International Symposium, APS 2015 - Proceedings. Vol. 2015-October IEEE, 2015. p. 607-608 7304690.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing

AU - Tehrani, Bijan K.

AU - Cook, Benjamin S.

AU - Tentzeris, Manos M.

PY - 2015/10/22

Y1 - 2015/10/22

N2 - This work outlines and demonstrates for the first time the utilization of inkjet printing processes for the fabrication of on-package mm-wave antenna structures. A multilayer, fully printed 30 GHz square patch antenna with a 120 μm thick dielectric substrate is fabricated directly onto an IC chip package through the use of metallic and dielectric inks. A probe station is used to measure the return loss of the fabricated on-package antenna, showing excellent agreement with simulations. This well defined process of fully additive antenna fabrication demonstrates the integrity of the inkjet printing process for on-package and on-chip antenna fabrication up to mm-wave frequency ranges.

AB - This work outlines and demonstrates for the first time the utilization of inkjet printing processes for the fabrication of on-package mm-wave antenna structures. A multilayer, fully printed 30 GHz square patch antenna with a 120 μm thick dielectric substrate is fabricated directly onto an IC chip package through the use of metallic and dielectric inks. A probe station is used to measure the return loss of the fabricated on-package antenna, showing excellent agreement with simulations. This well defined process of fully additive antenna fabrication demonstrates the integrity of the inkjet printing process for on-package and on-chip antenna fabrication up to mm-wave frequency ranges.

UR - http://www.scopus.com/inward/record.url?scp=84953738152&partnerID=8YFLogxK

U2 - 10.1109/APS.2015.7304690

DO - 10.1109/APS.2015.7304690

M3 - Conference contribution

AN - SCOPUS:84953738152

VL - 2015-October

SP - 607

EP - 608

BT - 2015 IEEE Antennas and Propagation Society International Symposium, APS 2015 - Proceedings

PB - IEEE

T2 - IEEE Antennas and Propagation Society International Symposium, APS 2015

Y2 - 19 July 2015 through 24 July 2015

ER -

Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing

Abstract

Conference

ASJC Scopus subject areas

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