Pull Testing of Lead-free QFP Solder Joints

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

5 Citations (Scopus)

Translated title of the contribution	Pull Testing of Lead-free QFP Solder Joints
Original language	English
Title of host publication	2002 Proceedings, 52nd Electronic Components & Technology Conference, San Diego, California, USA
Pages	1622-1626
Publication status	Published - 2002
Publication type	B3 Article in conference proceedings

Publication forum classification

@inproceedings{df82a98355b74290a79dc328d0862c58,

title = "Pull Testing of Lead-free QFP Solder Joints",

author = "J. Sundelin and S.T. Nurmi and T.K. Lepist{\"o} and E.O. Ristolainen",

note = "Contribution: organisation=mol elm,FACT1=1",

year = "2002",

language = "English",

pages = "1622--1626",

booktitle = "2002 Proceedings, 52nd Electronic Components \& Technology Conference, San Diego, California, USA",

}