Qualification of underfills, fluxes and solder resist for flip chip applications

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Translated title of the contribution	Qualification of underfills, fluxes and solder resist for flip chip applications
Original language	English
Pages (from-to)	850-854
Journal	Electrochemistry
Volume	67
Issue number	8
Publication status	Published - 1999
Publication type	A1 Journal article-refereed

Publication forum classification

@article{601a61cf4d364f1283d3458a67872627,

title = "Qualification of underfills, fluxes and solder resist for flip chip applications",

author = "A. Tuominen and V. Lehtinen and E. Ristolainen",

note = "Contribution: organisation=pori ttp,FACT1=1",

year = "1999",

language = "English",

volume = "67",

pages = "850--854",

journal = "Electrochemistry",

issn = "1344-3542",

publisher = "Electrochemical Society of Japan",

number = "8",

}