Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding

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Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, multilayered structures with through-silicon vias connection, and silicon photonics. Modern integration processes impose severe requirements on the design and functionality of research and assembly setups and their parts. In this work we demonstrate a simple, reliable, and cost-effective reconfigurable vacuum sample holder that ensures fast reconfiguration for electronic and photonic integration using laser assisted bonding (LAB) processes. The design is compatible with IR through-silicon microscopy with top and bottom irradiation/illumination architectures, which makes this concept instrumental for a large variety of research, assembly, lithography, and wafer bonding setups.

Original languageEnglish
Article number2500210
Number of pages10
JournalIEEE Photonics Journal
Issue number5
Publication statusPublished - 1 Oct 2023
Publication typeA1 Journal article-refereed


  • Assembly processes
  • infrared imaging
  • infrared microscopy
  • laser-assisted bonding
  • photonic integration
  • silicon devices
  • silicon photonics
  • through-silicon vision

Publication forum classification

  • Publication forum level 1

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering


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