Reducing bonding cycle time of adhesive flip chip

A. Seppälä, K. Aalto, E. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

9 Citations (Scopus)

Translated title of the contribution	Reducing bonding cycle time of adhesive flip chip
Original language	English
Pages (from-to)	16-20
Journal	Soldering and Surface Mount Technology
Volume	15
Issue number	1
Publication status	Published - 2003
Publication type	A1 Journal article-refereed

Publication forum classification

@article{df2bf1377d1c4ddfa87af4f8a644522b,

title = "Reducing bonding cycle time of adhesive flip chip",

author = "A. Sepp{\"a}l{\"a} and K. Aalto and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2003",

language = "English",

volume = "15",

pages = "16--20",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Group Publishing Ltd.",

number = "1",

}