Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test

Milad Mostofizadeh, Juha Pippola, Laura Frisk

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Translated title of the contribution	Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test
Original language	English
Title of host publication	CARTS International 2012 Proceedings, March 26-29, 2012, Las Vegas, Nevada, USA
Place of Publication	Alpharetta, GA
Publisher	Electronic Components Association ECA
Pages	1-12
Number of pages	12
Publication status	Published - 2012
Publication type	A4 Article in conference proceedings

Name	CARTS International Technical Conference

Publication forum classification

Mostofizadeh, M., Pippola, J., & Frisk, L. (2012). Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test. In CARTS International 2012 Proceedings, March 26-29, 2012, Las Vegas, Nevada, USA (pp. 1-12). (CARTS International Technical Conference). Electronic Components Association ECA. http://ecadigitallibrary.com/pdf/CARTSINT12/4_3_paper.pdf

@inproceedings{496841e62e66419493850f9550c61be5,

title = "Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test",

author = "Milad Mostofizadeh and Juha Pippola and Laura Frisk",

note = "ei ut-numeroa 22.8.2013<br/>Contribution: organisation=ele,FACT1=1<br/>Publisher name: Electronic Components Association ECA",

year = "2012",

language = "English",

series = "CARTS International Technical Conference",

publisher = "Electronic Components Association ECA",

pages = "1--12",

booktitle = "CARTS International 2012 Proceedings, March 26-29, 2012, Las Vegas, Nevada, USA",

}

Mostofizadeh, M, Pippola, J & Frisk, L 2012, Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test. in CARTS International 2012 Proceedings, March 26-29, 2012, Las Vegas, Nevada, USA. CARTS International Technical Conference, Electronic Components Association ECA, Alpharetta, GA, pp. 1-12. <http://ecadigitallibrary.com/pdf/CARTSINT12/4_3_paper.pdf>

Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test. / Mostofizadeh, Milad; Pippola, Juha; Frisk, Laura.
CARTS International 2012 Proceedings, March 26-29, 2012, Las Vegas, Nevada, USA. Alpharetta, GA: Electronic Components Association ECA, 2012. p. 1-12 (CARTS International Technical Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Reliability and Microstructural Evolution of Sn-Bi-Ag Solder Paste during Salt Spray Test

AU - Mostofizadeh, Milad

AU - Pippola, Juha

AU - Frisk, Laura

N1 - ei ut-numeroa 22.8.2013<br/>Contribution: organisation=ele,FACT1=1<br/>Publisher name: Electronic Components Association ECA

PY - 2012

Y1 - 2012

M3 - Conference contribution

T3 - CARTS International Technical Conference

SP - 1

EP - 12

BT - CARTS International 2012 Proceedings, March 26-29, 2012, Las Vegas, Nevada, USA

PB - Electronic Components Association ECA

CY - Alpharetta, GA

ER -