Reliability, electrical performance and properties of solder (63/37) bumped flip chip components

P. Palm; A. Tuominen; J. Määttänen; L. Uusitalo

Reliability, electrical performance and properties of solder (63/37) bumped flip chip components

P. Palm
, A. Tuominen
, J. Määttänen
, L. Uusitalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Translated title of the contribution	Reliability, electrical performance and properties of solder (63/37) bumped flip chip components
Original language	English
Title of host publication	Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510
Editors	S. Prasad, H.-D. Hartman, T. Tsujide
Publisher	SPIE
Pages	96-103
Number of pages	8
Publication status	Published - 1998
Externally published	Yes
Publication type	A4 Article in conference proceedings
Event	SPIE CONFERENCE PROCEEDINGS - Duration: 1 Jan 1900 → …

Conference

Conference	SPIE CONFERENCE PROCEEDINGS
Period	1/01/00 → …

Publication forum classification

No publication forum level

Cite this

Palm, P., Tuominen, A., Määttänen, J., & Uusitalo, L. (1998). Reliability, electrical performance and properties of solder (63/37) bumped flip chip components. In S. Prasad, H.-D. Hartman, & T. Tsujide (Eds.), Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510 (pp. 96-103). SPIE.

Palm, P. ; Tuominen, A. ; Määttänen, J. et al. / Reliability, electrical performance and properties of solder (63/37) bumped flip chip components. Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510. editor / S. Prasad ; H.-D. Hartman ; T. Tsujide. SPIE, 1998. pp. 96-103

@inproceedings{49514329bcff4b889baafa313964d715,

title = "Reliability, electrical performance and properties of solder (63/37) bumped flip chip components",

author = "P. Palm and A. Tuominen and J. M{\"a}{\"a}tt{\"a}nen and L. Uusitalo",

note = "ISSN: 0277-786X ; Ei TTKK:n nimiss{\"a}<br/>Contribution: organisation=pori etp,FACT1=1; SPIE CONFERENCE PROCEEDINGS ; Conference date: 01-01-1900",

year = "1998",

language = "English",

pages = "96--103",

editor = "S. Prasad and H.-D. Hartman and T. Tsujide",

booktitle = "Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510",

publisher = "SPIE",

address = "United States",

}

Palm, P, Tuominen, A, Määttänen, J & Uusitalo, L 1998, Reliability, electrical performance and properties of solder (63/37) bumped flip chip components. in S Prasad, H-D Hartman & T Tsujide (eds), Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510. SPIE, pp. 96-103, SPIE CONFERENCE PROCEEDINGS, 1/01/00.

Reliability, electrical performance and properties of solder (63/37) bumped flip chip components. / Palm, P.; Tuominen, A.; Määttänen, J. et al.
Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510. ed. / S. Prasad; H.-D. Hartman; T. Tsujide. SPIE, 1998. p. 96-103.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Reliability, electrical performance and properties of solder (63/37) bumped flip chip components

AU - Palm, P.

AU - Tuominen, A.

AU - Määttänen, J.

AU - Uusitalo, L.

N1 - ISSN: 0277-786X ; Ei TTKK:n nimissä<br/>Contribution: organisation=pori etp,FACT1=1

PY - 1998

Y1 - 1998

M3 - Conference contribution

SP - 96

EP - 103

BT - Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510

A2 - Prasad, S.

A2 - Hartman, H.-D.

A2 - Tsujide, T.

PB - SPIE

T2 - SPIE CONFERENCE PROCEEDINGS

Y2 - 1 January 1900

ER -

Palm P, Tuominen A, Määttänen J, Uusitalo L. Reliability, electrical performance and properties of solder (63/37) bumped flip chip components. In Prasad S, Hartman HD, Tsujide T, editors, Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510. SPIE. 1998. p. 96-103