Skip to main navigation Skip to search Skip to main content

Reliability Evaluation of 3D-Package with Specific Test Structures

  • J. Tanskanen
  • , T. Alander
  • , E.O. Ristolainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    5 Citations (Scopus)
    Translated title of the contributionReliability Evaluation of 3D-Package with Specific Test Structures
    Original languageEnglish
    Title of host publicationECTC2002 The 52nd Electronic Components and Technology Conference, May 28-31, 2002, Sheraton San Diego, Hotel & Marina, San Diego, California, USA
    Pages5 s
    Publication statusPublished - 2002
    Publication typeA4 Article in conference proceedings

    Publication forum classification

    • No publication forum level

    Cite this