Reliability Issues of Flip Chip Joining Using No-Flow Underfills

K. Aalto; E. Ristolainen

Reliability Issues of Flip Chip Joining Using No-Flow Underfills

K. Aalto, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific

Translated title of the contribution	Reliability Issues of Flip Chip Joining Using No-Flow Underfills
Original language	English
Title of host publication	14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany
Pages	303-307
Publication status	Published - 2003
Publication type	B3 Article in conference proceedings

Publication forum classification

No publication forum level

Access to Document

http://www.EMPC2003.de

Cite this

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title = "Reliability Issues of Flip Chip Joining Using No-Flow Underfills",

author = "K. Aalto and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2003",

language = "English",

pages = "303--307",

booktitle = "14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany",

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TY - GEN

T1 - Reliability Issues of Flip Chip Joining Using No-Flow Underfills

AU - Aalto, K.

AU - Ristolainen, E.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2003

Y1 - 2003

M3 - Conference contribution

SP - 303

EP - 307

BT - 14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany

ER -