Reliability of ACA bonded flip chip joints on LCP and FR-4 substrates

L. Frisk, A. Cumini

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Translated title of the contribution	Reliability of ACA bonded flip chip joints on LCP and FR-4 substrates
Original language	English
Title of host publication	EMPC 2007. The 16th European Microelectronics and Packaging Conference & Exhibition, June 17-20, 2007, Oulu, Finland
Pages	478-483
Publication status	Published - 2007
Publication type	A4 Article in conference proceedings

Publication forum classification

@inproceedings{29ad4da2ed714d04bf11e1cd668e5e68,

title = "Reliability of ACA bonded flip chip joints on LCP and FR-4 substrates",

author = "L. Frisk and A. Cumini",

note = "Contribution: organisation=ele,FACT1=1",

year = "2007",

language = "English",

pages = "478--483",

booktitle = "EMPC 2007. The 16th European Microelectronics and Packaging Conference & Exhibition, June 17-20, 2007, Oulu, Finland",

}