Reliability of ACA bonded flip chip joints on LCP and PI substrates

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16 Citations (Scopus)

Translated title of the contribution	Reliability of ACA bonded flip chip joints on LCP and PI substrates
Original language	English
Pages (from-to)	12-20
Journal	Soldering and Surface Mount Technology
Volume	18
Issue number	4
Publication status	Published - 2006
Publication type	A1 Journal article-refereed

Publication forum classification

@article{1ec227209a344eb38aca4b4471ae165e,

title = "Reliability of ACA bonded flip chip joints on LCP and PI substrates",

author = "L. Frisk and A. Cumini",

note = "Contribution: organisation=ele,FACT1=1",

year = "2006",

language = "English",

volume = "18",

pages = "12--20",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald",

number = "4",

}