Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives

Juha Niittynen; Santtu Koskinen; Matti Mäntysalo; Janne Kiilunen; Juha Pippola; Laura Frisk

Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives

Juha Niittynen, Santtu Koskinen, Matti Mäntysalo, Janne Kiilunen, Juha Pippola, Laura Frisk

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives
Original language	English
Title of host publication	SMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA
Place of Publication	Edina, Minnesota
Publisher	Surface Mount Technology Association
Pages	1-8
Number of pages	8
ISBN (Print)	978-0-9888873-3-6
Publication status	Published - 2014
Publication type	A4 Article in conference proceedings
Event	Pan Pacific Microelectronics Symposium - Duration: 1 Jan 2014 → …

Conference

Conference	Pan Pacific Microelectronics Symposium
Period	1/01/14 → …

Publication forum classification

No publication forum level

Cite this

@inproceedings{d23270c810cb4039a58685589f825956,

title = "Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives",

author = "Juha Niittynen and Santtu Koskinen and Matti M{\"a}ntysalo and Janne Kiilunen and Juha Pippola and Laura Frisk",

note = "Contribution: organisation=elt,FACT1=0.5 Contribution: organisation=dee,FACT2=0.5 Portfolio EDEND: 2014-05-08 Publisher name: Surface Mount Technology Association; Pan Pacific Microelectronics Symposium ; Conference date: 01-01-2014",

year = "2014",

language = "English",

isbn = "978-0-9888873-3-6",

pages = "1--8",

booktitle = "SMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA",

publisher = "Surface Mount Technology Association",

}

Niittynen, J, Koskinen, S, Mäntysalo, M, Kiilunen, J, Pippola, J & Frisk, L 2014, Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives. in SMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA. Surface Mount Technology Association, Edina, Minnesota, pp. 1-8, Pan Pacific Microelectronics Symposium, 1/01/14.

Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives. / Niittynen, Juha; Koskinen, Santtu; Mäntysalo, Matti et al.
SMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA. Edina, Minnesota: Surface Mount Technology Association, 2014. p. 1-8.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives

AU - Niittynen, Juha

AU - Koskinen, Santtu

AU - Mäntysalo, Matti

AU - Kiilunen, Janne

AU - Pippola, Juha

AU - Frisk, Laura

N1 - Contribution: organisation=elt,FACT1=0.5 Contribution: organisation=dee,FACT2=0.5 Portfolio EDEND: 2014-05-08 Publisher name: Surface Mount Technology Association

PY - 2014

Y1 - 2014

M3 - Conference contribution

SN - 978-0-9888873-3-6

SP - 1

EP - 8

BT - SMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA

PB - Surface Mount Technology Association

CY - Edina, Minnesota

T2 - Pan Pacific Microelectronics Symposium

Y2 - 1 January 2014

ER -