Reliability of high density flip chip on flex interconnection

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Translated title of the contribution	Reliability of high density flip chip on flex interconnection
Original language	English
Title of host publication	IMAPS - Europe Prague 2000, June 18-20, 2000, Prague, Czech Republic
Pages	111-115
Number of pages	5
Publication status	Published - 2000
Publication type	B3 Article in conference proceedings

Publication forum classification

@inproceedings{61de2323335e4a45b1e9006c0af789c7,

title = "Reliability of high density flip chip on flex interconnection",

author = "P. Palm and J. M{\"a}{\"a}tt{\"a}nen and A. Tuominen and E. Ristolainen",

note = "ttp 50 \% - ele 50 \%<br/>Contribution: organisation=pori ttp,FACT1=0.5<br/>Contribution: organisation=ele,FACT2=0.5",

year = "2000",

language = "English",

pages = "111--115",

booktitle = "IMAPS - Europe Prague 2000, June 18-20, 2000, Prague, Czech Republic",

}

TY - GEN

T1 - Reliability of high density flip chip on flex interconnection

AU - Palm, P.

AU - Määttänen, J.

AU - Tuominen, A.

AU - Ristolainen, E.

N1 - ttp 50 % - ele 50 %<br/>Contribution: organisation=pori ttp,FACT1=0.5<br/>Contribution: organisation=ele,FACT2=0.5

PY - 2000

Y1 - 2000

M3 - Conference contribution

SP - 111

EP - 115

BT - IMAPS - Europe Prague 2000, June 18-20, 2000, Prague, Czech Republic

ER -