Reliability of ICA passive component attachments under humid conditions

Laura Frisk; Sanna Lahokallio; Janne Kiilunen; Kirsi Saarinen

Reliability of ICA passive component attachments under humid conditions

Laura Frisk, Sanna Lahokallio, Janne Kiilunen, Kirsi Saarinen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	Reliability of ICA passive component attachments under humid conditions
Original language	English
Title of host publication	Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark
Editors	Kutilainen Jarkko
Place of Publication	Mölndal, Sweden
Publisher	International Microelectronics and Packaging Society, Nordic
Pages	140-145
ISBN (Print)	978-1-62276-316-0
Publication status	Published - 2012
Publication type	A4 Article in conference proceedings

Publication series

Name	International Microelectronics and Packaging Society Nordic Annual Conference

Publication forum classification

No publication forum level

Cite this

Frisk, L., Lahokallio, S., Kiilunen, J., & Saarinen, K. (2012). Reliability of ICA passive component attachments under humid conditions. In K. Jarkko (Ed.), Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark (pp. 140-145). (International Microelectronics and Packaging Society Nordic Annual Conference). International Microelectronics and Packaging Society, Nordic.

Frisk, Laura ; Lahokallio, Sanna ; Kiilunen, Janne et al. / Reliability of ICA passive component attachments under humid conditions. Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark. editor / Kutilainen Jarkko. Mölndal, Sweden : International Microelectronics and Packaging Society, Nordic, 2012. pp. 140-145 (International Microelectronics and Packaging Society Nordic Annual Conference).

@inproceedings{47d8956504794acab26ceade32909ffb,

title = "Reliability of ICA passive component attachments under humid conditions",

author = "Laura Frisk and Sanna Lahokallio and Janne Kiilunen and Kirsi Saarinen",

note = "ei ut-numeroa 12.8.2013<br/>Contribution: organisation=ele,FACT1=1<br/>Publisher name: International Microelectronics and Packaging Society, Nordic",

year = "2012",

language = "English",

isbn = "978-1-62276-316-0",

series = "International Microelectronics and Packaging Society Nordic Annual Conference",

publisher = "International Microelectronics and Packaging Society, Nordic",

pages = "140--145",

editor = "Kutilainen Jarkko",

booktitle = "Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsing{\o}r, Denmark",

}

Frisk, L, Lahokallio, S, Kiilunen, J & Saarinen, K 2012, Reliability of ICA passive component attachments under humid conditions. in K Jarkko (ed.), Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark. International Microelectronics and Packaging Society Nordic Annual Conference, International Microelectronics and Packaging Society, Nordic, Mölndal, Sweden, pp. 140-145.

Reliability of ICA passive component attachments under humid conditions. / Frisk, Laura; Lahokallio, Sanna; Kiilunen, Janne et al.
Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark. ed. / Kutilainen Jarkko. Mölndal, Sweden: International Microelectronics and Packaging Society, Nordic, 2012. p. 140-145 (International Microelectronics and Packaging Society Nordic Annual Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Reliability of ICA passive component attachments under humid conditions

AU - Frisk, Laura

AU - Lahokallio, Sanna

AU - Kiilunen, Janne

AU - Saarinen, Kirsi

N1 - ei ut-numeroa 12.8.2013<br/>Contribution: organisation=ele,FACT1=1<br/>Publisher name: International Microelectronics and Packaging Society, Nordic

PY - 2012

Y1 - 2012

M3 - Conference contribution

SN - 978-1-62276-316-0

T3 - International Microelectronics and Packaging Society Nordic Annual Conference

SP - 140

EP - 145

BT - Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark

A2 - Jarkko, Kutilainen

PB - International Microelectronics and Packaging Society, Nordic

CY - Mölndal, Sweden

ER -

Frisk L, Lahokallio S, Kiilunen J, Saarinen K. Reliability of ICA passive component attachments under humid conditions. In Jarkko K, editor, Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark. Mölndal, Sweden: International Microelectronics and Packaging Society, Nordic. 2012. p. 140-145. (International Microelectronics and Packaging Society Nordic Annual Conference).