Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

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17 Citations (Scopus)

Translated title of the contribution	Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors
Original language	English
Pages (from-to)	272-280
Number of pages	9
Journal	Microelectronics Reliability
Volume	54
Issue number	1
DOIs	https://doi.org/10.1016/j.microrel.2013.08.021
Publication status	Published - 2014
Publication type	A1 Journal article-refereed

Publication forum classification

@article{8a2c05a9f250464ebee111db6aca7b4b,

title = "Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors",

author = "Jussi Putaala and Jari Hannu and Esa Kunnari and Matti M{\"a}ntysalo and Olli Nousiainen and Heli Jantunen",

note = "Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-02-15<br/>Publisher name: Pergamon",

year = "2014",

doi = "10.1016/j.microrel.2013.08.021",

language = "English",

volume = "54",

pages = "272--280",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

number = "1",

}

TY - JOUR

T1 - Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

AU - Putaala, Jussi

AU - Hannu, Jari

AU - Kunnari, Esa

AU - Mäntysalo, Matti

AU - Nousiainen, Olli

AU - Jantunen, Heli

N1 - Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-02-15<br/>Publisher name: Pergamon

PY - 2014

Y1 - 2014

U2 - 10.1016/j.microrel.2013.08.021

DO - 10.1016/j.microrel.2013.08.021

M3 - Article

SN - 0026-2714

VL - 54

SP - 272

EP - 280

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 1

ER -