Reliability of tin-lead balled BGAs soldered with lead-free solder paste

S. Nurmi, E. Ristolainen

Research output: Contribution to journal › Article › Scientific › peer-review

12 Citations (Scopus)

Translated title of the contribution	Reliability of tin-lead balled BGAs soldered with lead-free solder paste
Original language	English
Pages (from-to)	35-39
Journal	Soldering and Surface Mount Technology
Volume	14
Issue number	2
Publication status	Published - 2002
Publication type	A1 Journal article-refereed

Publication forum classification

@article{4b5c02b91a4646648e4dfd68b55bc44a,

title = "Reliability of tin-lead balled BGAs soldered with lead-free solder paste",

author = "S. Nurmi and E. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2002",

language = "English",

volume = "14",

pages = "35--39",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald Group Publishing Ltd.",

number = "2",

}