Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing

Laura Frisk; Sanna Lahokallio; Milad Mostofizadeh; Janne Kiilunen; Kirsi Saarinen

doi:10.1109/ECTC.2013.6575819

Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing

Laura Frisk
, Sanna Lahokallio
, Milad Mostofizadeh
, Janne Kiilunen
, Kirsi Saarinen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

7 Citations (Scopus)

Translated title of the contribution	Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing
Original language	English
Title of host publication	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, USA, 28.-31.5.2013
Publisher	IEEE
Pages	1794-1799
Number of pages	6
ISBN (Print)	978-147990233-0
DOIs	https://doi.org/10.1109/ECTC.2013.6575819
Publication status	Published - 2013
Publication type	A4 Article in conference proceedings
Event	Electronic Components and Technology Conference - Duration: 1 Jan 1900 → …

Publication series

Name	Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	Electronic Components and Technology Conference
Period	1/01/00 → …

Publication forum classification

Publication forum level 1

Access to Document

10.1109/ECTC.2013.6575819

Cite this

Frisk, L., Lahokallio, S., Mostofizadeh, M., Kiilunen, J., & Saarinen, K. (2013). Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, USA, 28.-31.5.2013 (pp. 1794-1799). (Electronic Components and Technology Conference). IEEE. https://doi.org/10.1109/ECTC.2013.6575819

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title = "Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing",

author = "Laura Frisk and Sanna Lahokallio and Milad Mostofizadeh and Janne Kiilunen and Kirsi Saarinen",

note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-12-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE; Electronic Components and Technology Conference ; Conference date: 01-01-1900",

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language = "English",

isbn = "978-147990233-0",

series = "Electronic Components and Technology Conference",

publisher = "IEEE",

pages = "1794--1799",

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}

Frisk, L, Lahokallio, S, Mostofizadeh, M, Kiilunen, J & Saarinen, K 2013, Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing. in 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, USA, 28.-31.5.2013. Electronic Components and Technology Conference, IEEE, pp. 1794-1799, Electronic Components and Technology Conference, 1/01/00. https://doi.org/10.1109/ECTC.2013.6575819

Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing. / Frisk, Laura; Lahokallio, Sanna; Mostofizadeh, Milad et al.
2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, USA, 28.-31.5.2013. IEEE, 2013. p. 1794-1799 (Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

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AU - Lahokallio, Sanna

AU - Mostofizadeh, Milad

AU - Kiilunen, Janne

AU - Saarinen, Kirsi

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-12-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

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BT - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, USA, 28.-31.5.2013

PB - IEEE

T2 - Electronic Components and Technology Conference

Y2 - 1 January 1900

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Frisk L, Lahokallio S, Mostofizadeh M, Kiilunen J, Saarinen K. Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, USA, 28.-31.5.2013. IEEE. 2013. p. 1794-1799. (Electronic Components and Technology Conference). doi: 10.1109/ECTC.2013.6575819