RF-Performance of a Low Cost Flip Chip Assembly

J. Vahter; J. Heikkinen; J. Tanskanen; A. Seppälä; E. Ristolainen

RF-Performance of a Low Cost Flip Chip Assembly

J. Vahter
, J. Heikkinen
, J. Tanskanen
, A. Seppälä
, E. Ristolainen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Translated title of the contribution	RF-Performance of a Low Cost Flip Chip Assembly
Original language	English
Title of host publication	InterPACK'01 - The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, July 8-13, 2001, Kauai, Hawaii, USA
Pages	4 s
Publication status	Published - 2001
Publication type	A4 Article in conference proceedings

Publication forum classification

No publication forum level

Cite this

@inproceedings{408d2357b9c743ef940ca8ef5c17bd37,

title = "RF-Performance of a Low Cost Flip Chip Assembly",

author = "J. Vahter and J. Heikkinen and J. Tanskanen and A. Sepp{\"a}l{\"a} and E. Ristolainen",

note = "CD-ROM<br/>Contribution: organisation=ele,FACT1=1",

year = "2001",

language = "English",

pages = "4 s",

booktitle = "InterPACK'01 - The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference \& Exhibition, July 8-13, 2001, Kauai, Hawaii, USA",

}

RF-Performance of a Low Cost Flip Chip Assembly. / Vahter, J.; Heikkinen, J.; Tanskanen, J. et al.
InterPACK'01 - The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, July 8-13, 2001, Kauai, Hawaii, USA. 2001. p. 4 s.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - RF-Performance of a Low Cost Flip Chip Assembly

AU - Vahter, J.

AU - Heikkinen, J.

AU - Tanskanen, J.

AU - Seppälä, A.

AU - Ristolainen, E.

N1 - CD-ROM<br/>Contribution: organisation=ele,FACT1=1

PY - 2001

Y1 - 2001

M3 - Conference contribution

SP - 4 s

BT - InterPACK'01 - The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, July 8-13, 2001, Kauai, Hawaii, USA

ER -