Translated title of the contribution | Ruiskuvalettu multichip-moduuli |
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Original language | English |
Place of Publication | Tampere |
Publisher | Tampereen teknillinen korkeakoulu |
Number of pages | 43 |
Publication status | Published - 1993 |
Publication type | D4 Published development or research report or study |
Publication series
Name | Tampereen teknillinen korkeakoulu, Muovitekniikan laitos, Raportti |
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Publisher | Tampereen teknillinen korkeakoulu |
No. | 5/1993 |
Publication forum classification
- No publication forum level