Abstract
This article focuses on characterization of screen printed electrical interconnects for wearable applications. The interconnects are screen printed with stretchable silver-based ink on a thermoplastic polyurethane film. By optimizing the process parameters, we were able to fabricate 200 μm line widths with spacing of 200 μm. The average sheet resistance is 36.2 m/, however a significant lot-To-lot deviation was noted. In the strain tests, half of the samples have lost conductivity when 74.1% strain is reached. The normalized resistances of the samples rise linearly to approximately 30 % strain, after which the growth rate and deviation between samples increases significantly. It was also discovered that no cracking can be found from the traces while subjected to strains under 30%.
Original language | English |
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Title of host publication | Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference |
Publisher | IEEE |
Pages | 1650-1655 |
Number of pages | 6 |
ISBN (Electronic) | 9781509012039 |
DOIs | |
Publication status | Published - 16 Aug 2016 |
Publication type | A4 Article in conference proceedings |
Event | IEEE Electronic Components and Technology Conference - , United States Duration: 1 Jan 2000 → … |
Conference
Conference | IEEE Electronic Components and Technology Conference |
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Country/Territory | United States |
Period | 1/01/00 → … |
Keywords
- Printed electronics
- Screen printed
- Strechable
- Wearable
Publication forum classification
- Publication forum level 1
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering