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Sequential stress combinations in product level reliability testing of industrial electronics

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    4 Citations (Scopus)
    Translated title of the contributionSequential stress combinations in product level reliability testing of industrial electronics
    Original languageEnglish
    Title of host publicationThe 16th Electronics Packaging Technology Conference, EPTC 2014, 3-5 December 2014, Marina Bay Sands, Singapore
    Place of PublicationPiscataway, NJ
    PublisherIEEE
    Pages738-742
    Number of pages5
    ISBN (Print)978-1-4799-6994-4
    Publication statusPublished - 2014
    Publication typeA4 Article in conference proceedings
    EventIEEE Electronics Packaging Technology Conference -
    Duration: 1 Jan 1900 → …

    Conference

    ConferenceIEEE Electronics Packaging Technology Conference
    Period1/01/00 → …

    Publication forum classification

    • Publication forum level 1

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